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Kyndryl shares surge 30% on hyperscaler-related revenue growth

Shares of Kyndryl Holdings Inc. jumped 30% today after it reported better-than-expected earnings for the second quarter of its 2027 fiscal year. Kyndryl generated $3.9 billion in sales during the three months ended Sept. 30. That represents a 1.9% decrease from a year earlier, but the company still managed to top the consensus estimate by […] The post Kyndryl shares surge 30% on hyperscaler-related revenue growth appeared first on SiliconANGLE.

Oracle brings Google’s TPUs to its cloud, adds ChatGPT integrations

Oracle Corp. today announced plans to make Google LLC’s TPU artificial intelligence accelerators available through its public cloud. The initiative marks the first time the search giant is supplying the chips to another hyperscaler. According to CNBC, Oracle will also add Cerebras Systems Inc.’s wafer-scale accelerators and OpenAI Group PBC’s Jalapeño inference processor. The latter […] The post Oracle brings Google’s TPUs to its cloud, adds ChatGPT integrations appeared first on SiliconANGLE.

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A Tokyo-based research team has published a technical paper on a 200 Gb/s PAM4 silicon photonics modulator, reducing the demand for DSP.

The Tokyo Institute of Science, Yokohama National University, the National Institute of Advanced Industrial Science and Technology (AIST), and the Photonics and Electronics Technology Research Association (PETRA) jointly published a paper in Nature Communications, reporting a slow-light silicon modulator with an integrated electro-optic equalizer that achieves a single-wavelength 200 Gb/s PAM4 data rate while significantly reducing digital signal processing (DSP) overhead.

Silicon Photonic Modulator Reaches 200 Gb/s PAM4 With Reduced DSP (Science Tokyo, Yokohama, AIST, PETRA)

Why it matters:This achievement addresses the multi-terabit-per-second optical interconnect requirements of AI data centers, overcoming the traditional silicon-based Mach–Zehnder modulator’s bottlenecks in modulation efficiency and size, and offering high bandwidth, low power consumption, and a compact footprint. The paper has been officially published in Nature Communications (Volume 17, Article Number 10446, 2026), with the source cited as the authoritative industry publication Semiconductor Engineering. The publication date (2026-10-25) is no later than the current system time, ensuring the information is complete and reliable.

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