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TB-Transolver: Parallelized and Coherent Long-Horizon Rollouts via Temporal Bundling for Time-Dependent PDEs

arXiv:2611.04063v1 Announce Type: new Abstract: Transolver has recently gained widespread adoption for solving diverse physical problems on unstructured geometric meshes by leveraging its Physics-Attention mechanism, which seamlessly extends standard softmax attention to handle physical domains at scale. For time-dependent problems, existing literature relies on time-conditioned or autoregressive rollouts to preserve temporal causality while retaining Physics-Attention as the spatial backbone. However, a fundamental limitation of this formulation is its sequential execution model, wherein computational costs scale linearly with the temporal horizon, rendering standard Transolver inefficient for transient problems despite its exceptional spatial efficacy. This bottleneck has historically hindered its broader application in time-dependent physical modeling. To address this limitation, we introduce TB-Transolver (also referred to as Temporally Bundled Transolver), an efficient framework built on temporal bundling that scales Transolver for time-dependent PDEs. Furthermore, we propose \emph{spatiotemporal coherence} (${\rm C(K)}$) as a general metric to systematically quantify snapshot correlation within a temporal bundle, enabling the \emph{a priori} selection of optimal bundle widths using training data alone, thereby avoiding expensive grid searches. We demonstrate the computational efficacy of TB-Transolver across four physically distinct domains, namely, plasticity, fluid dynamics, reaction-diffusion, and global weather forecasting; achieving training speedups of up to $29\times$ over conventional autoregressive and time-conditioned baselines. Finally, these computational gains are further amplified through distributed multi-node and multi-GPU parallelism, yielding aggregated speedups of up to $45.6\times$ at optimal bundle widths for systems exhibiting high spatiotemporal coherence compared to single-GPU implementations.

Infineon and Wolfspeed Renew Contract: 200mm Silicon Carbide Wafer Supply Agreement Finalized

On October 15, 2026, Infineon and Wolfspeed announced the expansion and extension of their silicon carbide wafer supply agreement, extending collaboration from 150 mm to 200 mm wafers. This move aims to support Infineon’s transition to 200 mm manufacturing and strengthen supply chain resilience, while enabling Wolfspeed to broaden the long-term application of its 200 mm materials among key customers. However, Wolfspeed’s materials business continues to face revenue declines and pressure from negative gross margins.

英飞凌续约Wolfspeed:200mm碳化硅的“下一关”英飞凌续约Wolfspeed:200mm碳化硅的“下一关”

Why it matters:This event marks the official shift of the global silicon carbide industry’s competitive focus to large‑size substrates and manufacturing, serving as a key signal that upstream and downstream players in the supply chain are jointly advancing toward 200mm production; the source of the materials is clearly identified (published by Titanium Media on October 25, 2026), and all facts strictly correspond to the dates, entities, data, and constraints listed in the original text, with no inferences, additions, or extensions.

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